International Conference ELECTRONICS 2026: From SMT to Advanced Packaging- Manufacturing Meets Microinterconnects
Organized by Kaunas University of Technology, the conference serves as a platform for collaboration and discussion among representatives from academy, industry, and business.
Partners:
- TUD IAFT (Dresden University of Technology, Institute of Electronic Packaging Technology)
- IHP (IHP GmbH, Leibniz Institute for High Performance Microelectronics)
- Industry Partners: FINETECH, TELTONIKA, etc.
Conference Vision
A joint platform connecting SMT engineers, advanced packaging researchers, reliability specialists, and industry to build a shared technical language, bridge research and manufacturing, and grow German-Baltic collaboration around heterogeneous integration and microinterconnects.
Key Topic:
SMT & Manufacturing Integration
- Advanced SMT process integration
- Fine-pitch assembly & microinterconnect technologies
- Process optimization, automation & inspection quality
Advanced Packaging
- 3D heterogeneous integration & wafer-level packaging
- System-in-Package (SiP), bare-die integration
- Photonic packaging
- Packaging for power electronics
Reliability & Materials
- Reliability and failure mechanisms (incl. laser-related)
- SSIL-enabled SiP interconnect reliability
- Reliability-driven design & qualification strategies
- Materials/interfaces & non-destructive evaluation
Emerging & Cross-Cutting Technologies
- Edge AI and embedded intelligence
- AI-assisted electronics design, manufacturing and inspection
- Smart sensors and IoT
- Flexible & stretchable electronics
- MEMS & NEMS
- Energy harvesting
Power Electronics & Intelligent Electronic Systems
- Si, SiC and GaN power electronics
- Advanced packaging and integration for power electronics
- Intelligent control, monitoring and digital twins for power electronic systems
- AI/ML for power electronics and energy-efficient systems
- Reliability and thermal management
2D Materials in Electronics
- Graphene-focused device and integration research
- 2D-material interfaces in packaging/reliability contexts
Integrated Circuit (IC) Design & Design Technologies
- Analog, mixed-signal and RF IC design
- Digital and low-power IC design
- IC design for sensing, edge AI and embedded applications
- Design–technology co-optimization
- Open-source IC design flows, EDA tools and PDKs
- Design for advanced packaging and heterogeneous integration
Open Source in Microelectronics
- Open-source design and technology flows
- Promoting open-source microelectronics ecosystems in the EU
Strategic / Panel Themes
- Future of Advanced Packaging and Microelectronics in Europe
- Manufacturing Challenges in Heterogeneous Integration
- Building a Baltic Microelectronics & Semiconductor Ecosystem
- Role and cooperation of Chips Competence Centres in the Baltic States
- Industry–academia–research institute cooperation
- Joint Baltic/German participation in Chips JU and Horizon Europe projects
- Researcher, PhD and student exchange