Program

Day 1: ChipC2-LT conference- Theory, Research & Industrial Perspective

Morning

Opening Session (start 08:30)

  • Welcome from TUD IAFT, KTU, IHP (30 min)

Keynote Sessions: Industry (3 x 30 min)

  • 2-3 presentations from industrial partners (e.g. from FINETECH, Teltonika, 8devices, SiFemto,..)

Coffee break 10:30 + networking. Industry showroom + result presentation (90 min).

Keynote Sessions 12:00 – 13:00: Universities/Research 1 (2 x 30 min)

  • From Microinterconnects to Systems: Advanced Packaging Technologies for HPC and AI - Prof. Dr.-Ing. Juliana Panchenko. Dresden University of Technology, Institute of Electronic Packaging Technology.
  • Space-grade Opto-Electronic Interfaces for Satellite Payloads - Dr.-Ing. Philip Ostrovskyy, Group Leader, Circuit Design / Converters & High-Speed Logic Circuits. IHP GmbH, Leibniz Institute for High Performance Microelectronics.

Lunch 13:00 - 14:00

Keynote Sessions 14:00 – 16:00: Universities/Research 2 ( 4 x 30 min)

  • EDI, Latvia - invited talk. Topic to be agreed with EDI: power electronics / Edge AI / open-source silicon / European semiconductor initiatives
  • Presentation by KTU
  • Presentation by FMTC + Chip Competence Center LT
  • Co-Packed Optics Technologies at IAVT-TUD: Multi-Lithography Process Development for Polymeric Optics Integration in Electronic Systems - Dr. Krzysztof Nieweglowski, Research Group Leader Photonics Packaging, Dresden University of Technology, Institute of Electronic Packaging Technology.

Coffee break 16:00 + networking (30 min)

Keynote Sessions 16:30 – 18:30: Universities/Research 3 ( 4 x 30 min)

  • Presentation by Vilnius University (VU)
  • Presentation by IHP 2 (open-source, photonics, 2D materials, HF design, …)
  • Presentation by VilniusTech (VGTU)
  • Integration Technology Development of Radio-Frequency Chips for Flexible Electronics – Ran Yin, Photonics Packaging, Dresden University of Technology, Institute of Electronic Packaging Technology.

Day 1 End: 18:30

Dinner 19:00

Day 2: TiFEC conference, Round-Table Discussions

Morning:

08:30 – 09:30 Student Session: (6 x 10 min or 4x 15 min): open mix: MEMS/NEMS, energy harvesting, AI-assisted inspection, open-source IC design flows, GaN/2D materials student projects, IC Design & Design Technologies

Coffee break 09:30 (30 min)

Tour to Lithuanian Energy Institute 10:00 – 11:30

Tour to Material Science Institute 11:30 – 13:00

Lunch 13:00 - 14:00

Round Table: 14:00 – 15:00. Baltic-German Microelectronics Cooperation round-table discussion for research and industry participants. Topics for discussion:

  • Chips Competence Centers: capabilities and opportunities for cooperation
  • What Lithuania, Latvia and Germany can offer each other
  • Joint access to research infrastructure and expertise
  • Open-source silicon and accessible design tools for universities and SMEs
  • Joint Chips JU / Horizon Europe proposals
  • Industry needs and technology transfer
  • PhD/student/researcher mobility
  • Concrete follow-up actions for 2027

Conference Closing 15:00 – 15:15

  • Summary of outcomes
  • Future cooperation roadmap
  • Potential follow-up actions and funding opportunities

Tour to Kaunas Old Town 15:30 - 18:00