Program

Opening Session (start 08:30)

Welcome speech from the Rector of Kaunas University of Technology – Prof. Dr. Eugenijus Valatka. (10 min)
Research and Innovations at Kaunas University of Technology – Prof. Dr. Kęstutis Baltakys, Kaunas University of Technology. (20 min)

Keynote Sessions: Industry (2 × 20 min, 2 × 30 min)

Teltonika Telematics – Lukas Šalavėjus. (20 min)
Lithuanian Chips Competence Centre (ChipsC²-LT) – Saulius Tumėnas. (20 min)
Integrated Circuits and Systems Laboratory Activities – Dr. Rihards Novickis, Institute of Electronics and Computer (EDI), Riga, Latvia. (30 min)
Space-grade Opto-Electronic Interfaces for Satellite Payloads – Dr.-Ing. Philip Ostrovskyy, Group Leader, Circuit Design / Converters & High-Speed Logic Circuits, IHP GmbH, Leibniz Institute for High Performance Microelectronics. (30 min)

Coffee break 10:30 + networking (30 min)

Keynote Sessions 11:00 – 13:00: Universities/Research 1 (4 × 30 min)

From Microinterconnects to Systems: Advanced Packaging Technologies for HPC and AI – Prof. Dr.-Ing. Juliana Panchenko, Dresden University of Technology, Institute of Electronic Packaging Technology.
GaN PA and FEM Design from X-band to Ka-band – Prof. Po-Wei Chen, Vilnius Tech–Taipei Tech.
Ultrafast Laser Technologies for Advanced Electronics and Semiconductor Packaging – Dr. Romualdas Trusovas, Laser Technologies for Electronics Laboratory, Department of Laser Technologies, Center for Physical Sciences and Technology (FTMC).
Co-Packed Optics Technologies at IAVT-TUD: Multi-Lithography Process Development for Polymeric Optics Integration in Electronic Systems – Dr. Krzysztof Nieweglowski, Research Group Leader Photonics Packaging, Dresden University of Technology, Institute of Electronic Packaging Technology.

Lunch 13:00 – 14:00

Keynote Sessions 14:00 – 16:00: Universities/Research 2 (4 × 30 min)

Design and Analysis of Integrated Wide-Input-Range Step-Down DC–DC Converters for Automotive – Lukas Šalavėjus, Vilnius Tech.
Integration Technology Development of Radio-Frequency Chips for Flexible Electronics – Ran Yin, Photonics Packaging, Dresden University of Technology, Institute of Electronic Packaging Technology.
Microwave-defined photonic lattices on a chip: thin-film lithium niobate for electronic-photonic integration – Dr. Armandas Balčytis.
Overview of MEMS Technologies and Their Future Prospects – Samer Houri, Vilnius Tech.

Coffee break 16:00 + networking (30 min)

Keynote Sessions 16:30 – 18:00: Student Session (7 × 15 min)

High Voltage High Frequency Pulse Generation Technologies and Future Directions – Edgar Aleinikov, Vilnius Tech.
From Signal to Chip: Advanced Data Processing and Edge AI Opportunities for Hermetic Distribution Transformer Diagnostics – Rytis Bertulis, Kaunas University of Technology (KTU).
2D Material Integration in BEOL Processing: Challenges and Prospects – Sarunas Jankauskas, Kaunas University of Technology (KTU).
Development of a Configurable Coincidence-Measurement ASIC for Particle-Detector Instrumentation – Dovydas Liutkus, Technical University of Denmark (DTU).
Advanced Manufacturing Approaches for Hybrid Chip Integration – Dominykas Mendelis, Kaunas University of Technology (KTU).
Two-Stage High-Current Pulse Shaping Methods for Power Semiconductors Testing – Rokas Grigaliunas, Kaunas University of Technology (KTU).
Future Prospects of Further Development of the Custom RISCV 32-bit Single-Core Architecture SoC – Manfredas Lamsargis & Dovydas Liutkus, Kaunas University of Technology (KTU).

Day 1 End: 18:00

Dinner 19:00

Rapid Prototyping, Testing and Characterization Session

Mlab 08:00 – 09:00

09:10 – 10:10: Baltic-German Microelectronics Cooperation Discussion

Discussion for research and industry participants. Topics for discussion:

Summary 10:15 – 10:30

Coffee break 09:30 (30 min)

Energy Session

Tour to Lithuanian Energy Institute 10:30 – 11:30

Material Science

Tour to Material Science Institute 12:00 – 13:00

Lunch 13:00 – 14:00

Closing Event in Čiurlionis Museum 15:00 – 16:00

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